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Mechanic Solder Paste Flux 183 Degree 10CC XG-Z40 with Syringe Needle tip for PCB SMD Mobile Phone Repair XG Z40 Soldering Paste

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Mechanic Solder Paste Flux 183 Degree 10CC XG-Z40 with Syringe Needle tip for PCB SMD Mobile Phone Repair XG Z40 Soldering Paste

10CC Mechanic Tin XG-Z40 Solder Paste Flux 25-45um Syringe for PCB SMD Mobile Phone Repair XG Z40 Soldering Paste

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Description

MECHANIC XG-Z40 High synthetic BGA Solder Flux Paste Soldering Tin Cream 10ml solder paste tin. Applicable to PCB, BGA, SMD, PGA repair. Mechanic solder tin paste xg-z40 Solder Paste Flux 25-45um Syringe to Mobile Phone Repair Services Indust


MECHANIC XG-Z40 High synthetic BGA Solder Flux Paste BGA Soldering Tin Cream
PCB BGA Soldering Paste Flux Solder BAG Ball Flux Paste

The BGA Flux Solder Paste is a high viscosity no-clean flux, it can be used for PCB, SMD, reworking, it can be used for soldering and reballing of computer and phone chips.

It is a mixture of high-quality alloyed powder and resinic pasty flux, it can avoid the pale yellow residue, so you are easy to clean the board.

Function:

Soldering paste for cell phone PCB and SMD etc.

Help to repair the circuit boards and protect the electronic components

A necessary material for repairing the mobile phone mainboard

Flux Solder Paste – no clean soldering

MECHANIC BGA Solder Flux Paste Soldering Tin Cream

Specification:

Material: tin+solder paste

Color: As picture shown

Size: Approx. 1.30*1.30*1.14inch / 3.3*3.2*2.9cm

Type: XG-Z40

Microns: 25-45um

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